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Dielectric metasurfaces, known for their low loss and subwavelength scale, are revolutionizing optical systems by allowing multidimensional light modulation. Researchers have now innovated in this field by developing a liquid crystal-based dielectric metasurface that streamlines manufacturing and enhances device performance.

Dielectric metasurfaces represent one of the cutting-edge research and application directions in the current optical field. They not only possess the advantage of low loss but also enable the realization of device thicknesses at subwavelength scales. Moreover, they can freely modulate light in multiple dimensions such as amplitude, phase, and polarization. This capability, which traditional optics lacks, holds significant importance for the integration, miniaturization, and scaling of future optical systems. Consequently, dielectric metasurfaces have attracted increasing industrial attention.

In this study, Professor Daping Chu’s team at the University of Cambridge developed a novel liquid crystal-based tunable dielectric metasurface. By leveraging the dielectric metasurface’s inherent alignment effect on liquid crystals on top of its electrically controllable properties, the need for liquid crystal alignment layer materials and related processes is eliminated, thus saving device manufacturing time and costs. This has practical implications for devices such as liquid crystal on silicon (LCoS).

Many of us have seen photos of and read stories about robots working on the production floor in factories, speeding up old-school assembly lines to build products more quickly. And while the robotics trend in manufacturing is continuing to grow, that’s not the only way technology (including artificial intelligence) and automation are impacting the industry.

From enhancing worker safety to more efficiently moving goods and materials from point A to point B, automation is making its mark on the manufacturing industry, and tech experts expect even more changes and improvements in the near future. Below, 17 members of Forbes Technology Council discuss specific manufacturing tasks that are (or soon will be) handled more efficiently, safely and productively by technology and automation.

When we take a stroll on the beach, we walk on the sand without any trouble. The sand appears solid and is difficult to compress. When we put the same sand grains in an hourglass, they behave very differently: the sand flows like a liquid.

Year 2023 face_with_colon_three

The new manufacturing method deals with the packaging substrate, the material to which chip dies are bonded. Intel and others have long used plastic (also known as organic) substrates, but the material can shrink or warp during the chip-making process, leading to defects.

Continue reading “Intel to Build Next-Generation Chips Using ‘Glass Substrate’” »

Thesis:

Part I: It has been proven that the human mind cannot be analogous to an electronic (or any other type of) computer, and the functioning of an intellective mind cannot be reproduced (though it can certainly be simulated) by any type of mechanical device, including modern artificial intelligence systems.

Part II: It is further impossible that the human mind is a purely material thing (including some “emergent property” of matter).

Estimation of the mass of all visible matter of thf universe.

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Novel metamaterial-based architectures offer a promising platform for building mass-producible, reprogrammable schemes that perform computing tasks with light.

MIT researchers devise new technique to visualize the internal forces within granular materials in intricate 3D detail.

To enhance this efficiency, there is a requirement to fabricate electrodes with a porous structure. Unfortunately, existing technologies face challenges in achieving a uniform coating of ceramic materials within electrodes possessing intricate porous structures.

A collaborative research team, comprising Professor Jihwan An and Ph.D. candidate Sung Eun Jo from the Department of Mechanical Engineering at Pohang University of Science and Technology (POSTECH), and others, has successfully produced porous electrodes for SOFCs using latest semiconductor processes. This research has been featured as a back cover article in Small Methods.

The process of atomic layer deposition (ALD) involves depositing gaseous materials onto a substrate surface in thin, uniform atomic layers. In a recent study, Professor Jihwan An’s team, known for their prior work in enhancing the efficiency of SOFCs using ALD, developed and applied a powder ALD process and equipment. This enabled them to precisely coat nano-thin films on fine powders.