WROCLAW, Poland/STOCKHOLM, June 16 (Reuters) — Intel (INTC.O) plans to invest up to $4.6 billion in a new semiconductor assembly and test facility near Wrocław, Poland, as part of a multi-billion-dollar investment drive across Europe to build chip capacity, it said on Friday.
The U.S. chipmaker last year announced plans to build a big chip complex in Germany along with facilities in Ireland and France as it seeks to benefit from European Commission’s eased funding rules and subsidies as the EU looks to cut its dependence on U.S. and Asian supply.
The facility in Poland will employ 2,000 workers and create several thousand additional jobs during the construction phase and hiring by suppliers, the company said in a statement.
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