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When I 1st read this headline, I had to pause and ask myself “was the article’s author informed at all on QC?” especially given China’s own efforts much less D-Wave, Google, and University of Sydney. And, then I read the article and I still have to wonder if the author is on top of the emerging technologies such as BMI, graphene, QC, and other nanotechnology that are already being tested to go live in the next 7 to 10 years plus much of the content is very superficial at best. I am glad that the author did put the tid bit on Singularity as the endpoint state; however, that is pretty well known. Nonetheles, sharing to let you be the judge.


For decades, we relied on silicon as the semiconductor for our computer chips. But now, working at nanometer scales, it looks like physical limitations may end the current methods to include more and more processing power onto each individual chip.

Many companies are making billion-dollar investments to continue scaling down semiconductor technology. The pressures of big data and cloud computing are pushing the limits of the current semiconductor technology in terms of bandwidth, memory, processing speed, and device power consumption.

Today’s state-of-the-art silicon chips are engineered at the 22- and 14-nanometer scale. Research is underway to take that down to 10-nanometer scale in the next several years.

Storage in your laptop or smartphone is a compromise between volume, access speed and physical size. But, the industry’s competition to shrink them while boosting their specifications is fierce. A few months after shipping a 16TB solid-state drive, Samsung has announced a fast, efficient 512GB SSD that’s half the size of a postage stamp.

Samsung’s press release claims that the drive is the first mass-produced 512GB SSD with non-volatile memory express (NVMe), a host-controller interface with a streamlined register for speed, in a single package. Unlike other hard drives in multi-chip packages (MCP), Samsung’s new drive is organized in a ball grid array into a collected unit, making it simpler to fit in and connect to other parts in the device. This makes the drive ideal for the ultra-slim notebook PC market, where space and weight are at a premium.

A senior Samsung VP said in a press release that the tiny drive triples the performance of a typical SATA SSD. Its read/write speeds of up to 1,500MB/s and 900MB/s, respectively, mean you could transfer a 5GB HD video in 3 seconds. Samsung will start selling the drive in June in 512GB, 256GB and 128GB models.

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Make no mistake, today’s wearables are clever pieces of kit. But they can be bulky and restricted by the devices they must be tethered to. This has led engineers to create thinner and more powerful pieces of wearable technology that can be applied directly to the skin. Now, researchers at the University of Wisconsin-Madison, led by Zhenqiang “Jack” Ma, have developed “the world’s fastest stretchable, wearable integrated circuits,” that could let hospitals apply a temporary tattoo and remove the need for wires and clips.

With its snake-like shape, the new platform supports frequencies in the .3 gigahertz to 300 gigahertz range. This falls in what is set to become the 5G standard. For a mobile phone, 5G enables faster speeds and greater coverage, but with epidermal electronics, engineers have discussed the possibility that wearers could transmit their vitals to a doctor without having to leave their home.

While the idea isn’t unique, the integrated circuits created by Ma and his team have a much smaller footprint than those developed by other researchers. Earlier transmission lines can measure up to 640 micrometers (or .64 millimeters), but UW–Madison’s solution is just 25 micrometers (or .025 millimeters) thick. The Air Force Office of Scientific Research also supports Ma’s research, suggesting that his wearable breakthroughs may help pilots of the future.

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New fundamental research by UT Dallas physicists may accelerate the drive toward more advanced electronics and more powerful computers.

The scientists are investigating materials called topological insulators, whose surface electrical properties are essentially the opposite of the properties inside.

“These materials are made of the same thing throughout, from the interior to the exterior,” said Dr. Fan Zhang, assistant professor of physics at UT Dallas. “But, the interior does not conduct electrons — it’s an insulator — while the electrons on the surface are free to move around. The surface is therefore a conductor, like a metal, but it is in fact more robust than a metal.”

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The consumer marketplace is flooded with a lively assortment of smart wearable electronics that do everything from monitor vital signs, fitness or sun exposure to play music, charge other electronics or even purify the air around you — all wirelessly.

Now, a team of University of Wisconsin—Madison engineers has created the world’s fastest stretchable, wearable integrated circuits, an advance that could drive the Internet of Things and a much more connected, high-speed wireless world.

Led by Zhenqiang “Jack” Ma, the Lynn H. Matthias Professor in Engineering and Vilas Distinguished Achievement Professor in electrical and computer engineering at UW–Madison, the researchers published details of these powerful, highly efficient integrated circuits today, May 27, 2016, in the journal Advanced Functional Materials.

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A family of compounds known as perovskites, which can be made into thin films with many promising electronic and optical properties, has been a hot research topic in recent years. But although these materials could potentially be highly useful in applications such as solar cells, some limitations still hamper their efficiency and consistency.

Now, a team of researchers at MIT and elsewhere say they have made significant inroads toward understanding a process for improving perovskites’ performance, by modifying the material using intense light. The new findings are being reported in the journal Nature Communications, in a paper by Samuel Stranks, a researcher at MIT; Vladimir Bulovic, the Fariborz Maseeh (1990) Professor of Emerging Technology and associate dean for innovation; and eight colleagues at other institutions in the U.S. and the U.K. The work is part of a major research effort on perovskite materials being led by Stranks, within MIT’s Organic and Nanostructured Electronics Laboratory.

Tiny defects in perovskite’s crystalline structure can hamper the conversion of light into electricity in a solar cell, but “what we’re finding is that there are some defects that can be healed under light,” says Stranks, who is a Marie Curie Fellow jointly at MIT and Cambridge University in the U.K. The tiny defects, called traps, can cause electrons to recombine with atoms before the electrons can reach a place in the crystal where their motion can be harnessed.

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The light field from a microcavity can be used to measure the displacement of a thin bar with an uncertainty that is close to the Heisenberg limit.

Tracking the exact location of an object is important in gravitational-wave detectors and optical cooling techniques. However, quantum physics imposes certain limits on the measurement precision. Tobias Kippenberg and his colleagues at the Swiss Federal Institute of Technology in Lausanne have devised an optomechanical device that measures the displacement of a tiny vibrating bar at room temperature with an uncertainty near the so-called Heisenberg limit. The precision of the sensor is nearly 10,000 times smaller than the zero-temperature fluctuations (zero-point motion) of the bar.

The Heisenberg uncertainty principle says—in practical terms—that any measurement of an object’s position will unavoidably give it a push that disturbs its momentum. To minimize this backaction, researchers have developed systems that couple the position of an object with the light field from an optical cavity.

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Non-diffracting Bessel vortex beams exhibit diverse propagation regimes in glass that can be observed with a novel imaging strategy.

High-power femtosecond pulses have become a key tool in processing of transparent materials (e.g., glass and sapphire) for the present and the next generation of consumer electronics.1 Associated major industrial challenges include high-quality and high-speed cutting of screen glass for smartphones, camera windows, or drilling of through-vias (vertical interconnect access) in interposers for the circuitry of 3D electronic chips. Ultrafast laser pulses (on picosecond or femtosecond timescales) allow for structuring transparent materials with high levels of accuracy. When the laser pulses propagate into the transparent dielectrics, they usually undergo high distortions.2 These distortions arise because of the nonlinear Kerr self-focusing effect and because of the interaction of the pulse with the plasma, which the pulses generate in the material. The propagation is therefore highly nonlinear and prevents uniform energy deposition along the beam propagation.

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